Status | Active |
---|---|
Category | PCB Headers |
Series | 87427 |
Application | Power, Wire-to-Board |
Comments | Current = 13A max. per circuit when header is mated to a receptacle loaded with 45750 Mini-Fit® Plus HCS Crimp Terminal Crimped to 16 AWG wire., See Molex product specification PS-45750-001 for additional current de-rating information. |
Overview | Mini-Fit Jr.™ Power Connectors |
Product Name | Mini-Fit Jr.™ |
UPC | 800754779753 |
Wire-to-Wire |
Wire-to-Board |
Board-to-Board |
FFC/FPC |
I/O Connector |
Antenna |
Thin-Film Battery |
Power Connector |
RF/Coax Connectors |
Socket |
방수용 Connector |
Terminal Block |
Isolators/ Circulators |
Edge Card Connector |
Mobile |
Automotive |
LED Lighting |
Industrial |
1.25 mm Pitch |
2.50mm Pitch |
2.54mm Pitch |
4.20mm Pitch |
5.03mm Pitch |
6.20 mm Pitch |
1.00mm Pitch |
1.20mm Pitch |
1.25mm Pitch |
1.27mm Pitch |
1.50mm Pitch |
2.00mm Pitch |
2.50mm Pitch |
2.54mm Pitch |
3.00mm Pitch |
3.50mm Pitch |
4.00mm Pitch |
4.20mm Pitch |
5.70mm Pitch |
10.00mm Pitch |
0.40mm Pitch |
0.50mm Pitch |
2.00mm Pitch |
0.635mm Pitch |
Power Connector |
HIGH SPEED |
0.3mm Pitch |
0.50mm Pitch |
1.0mm Pitch |
FFC/FPC JUMPER |
Consumer / PC |
산업용 |
모바일 제품 |
전기통신장비 |
GPS |
WiFi |
GPS & WiFi |
1.5V |
3.0V |
10A 이상 |
15A 이상 |
20A 이상 |
SMA RF |
TYPE F RF |
Micro-SD |
Micro-SIM |
CAMERA SOCKET |
Mizu-P25™ |
MX150L™ |
CMC |
MXP120™ |
2.5mm Pitch |
Isolators |
Circulators |
3.96mm Pitch |
Mixed Power/Signal |
방수용 Connector |
Wire-to-Board |
RF/MICROWAVE/COAX |
COB LED Holder |
Brad® |
회사소개 |
회사연혁 |
조직도 |
찾아오시는길 |
Wire-to-Board
4.20mm Pitch
- 87427-0402
-
-
- 87427-0402 (Mini-Fit® Jr. Header)
- Mini-Fit® Jr. Header, 4.20mm Pitch, Right Angle, without Flange, 4 Circuits, Tin (Sn) over Nickel (Ni) Plating
-
- 판매가격
- 0 원
-
- 제조사
- molex
-
- MOQ
- 1,740EA
Physical
Breakaway No Circuits (Loaded) 4 Circuits (maximum) 4 Color - Resin Beige Durability (mating cycles max) 30 First Mate / Last Break No Flammability 94V-0 Glow-Wire Compliant No Lock to Mating Part Yes Material - Metal Brass Material - Plating Mating Tin Material - Plating Termination Tin Material - Resin Nylon Net Weight 1.950/g Number of Rows 2 Orientation Right Angle PC Tail Length 3.30mm PCB Locator No PCB Retention None PCB Thickness - Recommended 1.60mm Packaging Type Tray Pitch - Mating Interface 4.20mm Pitch - Termination Interface 4.20mm Plating min - Mating 2.540µm Plating min - Termination 2.540µm Polarized to Mating Part Yes Polarized to PCB No Shrouded Fully Stackable No Surface Mount Compatible (SMC) No Temperature Range - Operating -40°C to +105°C Termination Interface: Style Through Hole Electrical
(Please review the Product Specification for specific details.) Current - Maximum per Contact 13.0A Voltage - Maximum 600V Agency Certification
Please find UL Certificates by searching the UL Database using the Molex Series Number. Click here to visit the UL Database CSA LR19980 UL E29179 Solder Process Data
Duration at Max. Process Temperature (seconds) 005 Lead-freeProcess Capability WAVE Max. Cycles at Max. Process Temperature 001 Process Temperature max. C 260 Material Info
Reference - Drawing Numbers
Product Specification PS-45750-001, PS-87427-0001 Sales Drawing SD-87427-**0*